Solder Paste

An evolution of the highly successful NC258 platform, M8 brings no clean solder paste performance to the next level. Developed in combination with T4 and finer mesh leaded alloy powders, M8 provides stable transfer efficiencies required for today’s UFP and umBGA devices, reducing DPMO on the most challenging applications.

An evolution of the highly successful NC258 platform, M8 brings no clean solder paste performance to the next level. Developed in combination with T4 and finer mesh leaded alloy powders, M8 provides stable transfer efficiencies required for today’s UFP and umBGA devices, reducing DPMO on the most challenging applications.

AIM’s WS488 water soluble paste has been designed to wet virtually any solderable electronic surfaces, components, assemblies, and substrates. WS488 is compatible with all leaded and lead-free alloys, and has been developed for use in a wide range of applications.

AIM’s WS488 water soluble paste has been designed to wet virtually any solderable electronic surfaces, components, assemblies, and substrates. WS488 is compatible with all leaded and lead-free alloys, and has been developed for use in a wide range of applications.

Indium8.9 is an air or nitrogen reflow, no-clean solder paste specifically formulated to accommodate the higher processing temperatures required by SnAgCu, SnAg, and other alloy systems favored by the electronics industry to replace Pb-bearing solders.

Offers excellent stencil print transfer efficiency to work in the broadest range of processes. In addition, the superior soldering performance under high- temperature and long reflow processes provides exceptional head-in-pillow performance.

Indium3.2 is an air or nitrogen reflow, water-soluble solder paste specifically formulated to accommodate the higher processing temperatures required by the SnAgCu, SnAg, SnSb, and other Pb-free alloy systems.

This product formulation offers consistent, repeatable printing performance combined with a long stencil life and sufficient tack strength to handle the challenges of today’s high-speed as well as high-mix surface mount lines. In addition to consistent printing and reflow requirements, this solder paste offers superb wetting to the various Pb-free metallizations and has exceptional low-voiding performance on fine-pitch components, including BGAs and CSPs.

Indium6.3 Water-Soluble Solder Paste is a halogen-free solder paste offering excellent wetting and solder-joint appearance, strong print performance with low slumping, a wide reflow window, and very low voiding. It is designed for stencil printing and dispensing applications and is compatible with a wide range of surface finishes

NC-SMQ92J is a halogen-free, air reflow, no-clean solder paste formulated to leave a benign, probe-testable residue. The residue is easily penetrated and will not clog multi-point probes. This product has other qualities such as consistent fine-pitch paste deposition, unsurpassed stencil life and tack time, and excellent wetting.

NC-SMQ92J will perform well on high-speed surface mount lines utilizing fast print speeds and rapid chip placement. NC-SMQ92J meets or surpasses all ANSI/J-STD-004, -005 specifications, and Bellcore test criteria.